Frame of dual in line package pads utilized to replace damaged pads on printed circuit boards



The sole FIGURE is a top plan view of the frame of dual in line packagepads utilized to replace damaged pads on printed circuit boards showingmy new design. The frame is flat with no substantial thickness and thebottom surface is identical to the top.

The ornamental design for a frame of dual in line package pads utilizedto replace damaged pads on printed circuit boards, as shown anddescribed.